COB LED Process

COB stands for chip on board, which means that the bare chip is adhered to the interconnect substrate with conductive or non-conductive glue, and then wire bonding is performed to achieve its electrical connection. COB LED is also called COB LED source, COB LED module. There are three types of packaging: long strip/square/circular.
Process
The COB LED surface light source first covers the silicon wafer placement point on the substrate surface with thermal conductive epoxy resin (generally epoxy resin doped with silver particles), and then directly places the silicon wafer on the substrate surface, heat treats until the silicon wafer is firmly fixed on the substrate, and then uses wire bonding to directly establish electrical connection between the silicon wafer and the substrate. There are two main forms of bare chip technology: one is COB technology, and the other is flip chip technology (Flip Chip). In chip on board packaging (COB), the semiconductor chip is interlocked and mounted on the printed circuit board, and the electrical connection between the chip and the substrate is achieved by wire stitching, and covered with resin to ensure reliability. Although COB is the simplest bare chip mounting technology, its packaging density is far inferior to TAB and flip chip soldering technology.